plating-adhesion

Electroplating does not hide bad machining; it magnifies it. Learn how the Ra (Roughness Average) of your substrate impacts plating thickness distribution, corrosion resistance, and final cosmetics.

Electroplating is highly sensitive to the metallurgical state of the substrate. Learn why the timing of case hardening, annealing, and stress relieving dictates the success or failure of the final plated finish.

If your plating is peeling, your cleaning line is failing. Learn the distinct roles of hot alkaline soak cleaners and anodic/cathodic electrocleaners in preparing metal for perfect adhesion.

A technical guide to the copper strike layer. Understand why attempting to plate directly onto certain substrates causes immediate adhesion failure, and how a thin, cyanide or alkaline copper strike ensures a flawless final deposit.